HOREXS semiconductor ic package substrate With Chip Wire Bonding

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

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HOREXS semiconductor ic package substrate With Chip Wire Bonding

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HOREXS semiconductor ic package substrate With Chip Wire Bonding

Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics...

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Horexs Bga Circuit Board

Ultra Thin Bga Circuit Board

Bga Circuit Board With Wire Bonding

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